Packaging and Interconnect for Micro- and Nano-scale Systems
نویسندگان
چکیده
Packaging and interconnect technologies are critical to the advancement of micro-scale and nano-scale systems. This paper will review some examples of our studies on flip-chip assembly, solder self-assembly, automated tuning and fixing, flexible circuits, atomic layer deposition and liquid crystal polymer for manufacturable and reliable microelectromechanical systems (MEMS). In addition, we will discuss packaging and interconnect technologies for nano-scale systems with two examples: 1) a chemoselective biomolecular template (tobacco mosaic virus mutant) for fabricating nano-scale interconnects and 2) selfassembly of bio-molecular motors for DNA and protein detection. Using these examples, we will discuss challenges for microand nano-scale packaging and challenges for the integration of these devices with microwave, optical and digital electronics.
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